Vapour Phase Soldering
Founded in 1995, Asscon have fully focused on Vapour Phase soldering machines so that they have mastered the science. Their company policy is 'innovations for you lead", implying that they are diverse and always integrating the latest technology and functions for their products. There are over three hundred thousand Asscon machines installed worldwide and they are renowned for their reliability at large production..
If you would like to request further information about any of our products below, please contact us.
Q 300
Small, simple and easy to use Vapour Phase Soldering Machine
Key Features
* High mobility
* Oxygen Free Process
* Lead Free Capabilities
* Temperature Gradiant Control
* Optical Process Control
* Automatic Recognition
Q 450
Convenient Operating Laboratory Reflow Soldering System
Key Features
* Integrated Cooling System
* Automatic Process Procedure
* Automatic Medium Recognition
* Adjustable Temperature Gradient
* Oxygen Free Process
* Unrestricted Lead Free Capability
VP 800
Universally Applicable, Flexible Reflow Soldering System.
Key Features
* Void free solder joints by application of vacuum treatment of the assembly after melting
* Suitable for lead-free applications without any limitation
* No time-expensive preparation of temperature profiles
* Short heating-up time
* Operator convenience with microprocessor controlling
* Automatic operation in a production line (SMEMA-interface definition)
VP 1000
Universally Applicable, Flexible Reflow Soldering System.
Key Features
* Economical soldering system for highest technological requirements
* Overheating of the solder product is impossible
* No shadowing or color selectivity
* Reproducible process conditions
* Low operating costs
* Oxidation-free pre-heat and soldering process
VP 2000
Innovative Soldering Machine For Mass Production.
Key Features
* High rate of throughput with in-line processing
* Oxidations-free pre-heating and soldering process
* No shadowing or color selectivity
* No time-absorbing generation of temperature profiles
* Low production costs
* Control and failure message system
VP 6000
User-friendly in-line SMT reflow soldering system.
Key Features
* Unrestricted Lead Free Capability
* Process is Oxygen Free
* Automatic Recognition of Full Soldering Process
* Temperature Adjustable
* Visual Process Control
* Low Operating Costs
VP 7000
Universally Applicable, Flexible Reflow Soldering System.
Key Features
* Void free solder joints by application of vacuum treatment of the assembly after melting
* Suitable for lead-free applications without any limitation
* No time-expensive preparation of temperature profiles
* Short heating-up time
* Operator convenience with microprocessor controlling
* Automatic operation in a production line (SMEMA-interface definition)